1398 search results - page 25 / 280 » Application-Specific Integrated Circuits |
ITC
1996
IEEE
14 years 2 months ago
1996
IEEE
common use is the distinction into two (abstract) fault models: A new fault modelling scheme for integrated analogue general the "Single Hard Fault Model (SHFM)" and the ...
ICCAD
2009
IEEE
13 years 7 months ago
2009
IEEE
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die va...
ASPDAC
1998
ACM
14 years 2 months ago
1998
ACM
ABSTRACT - This paper presents a new design flow, FPDSiMPA, and a set of techniques for synthesizing high-performance sub-half micron logic circuits. FPD-SiMPA consists of logic p...
ICCAD
2007
IEEE
14 years 7 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
DATE
2002
IEEE
14 years 3 months ago
2002
IEEE
A unified approach to fault simulation for FGDs is introduced. Instead of a direct fault simulation, the proposed approach calculates indirectly from the simulator output the set...