1398 search results - page 28 / 280 » Application-Specific Integrated Circuits |
62
Voted
DAC
2004
ACM
16 years 3 months ago
2004
ACM
80
Voted
VLSID
2005
IEEE
16 years 3 months ago
2005
IEEE
The electromigration effect within current-density-stressed signal and power lines is an ubiquitous and increasingly important reliability and design problem in sub-micron IC desi...
75
Voted
ICCAD
2001
IEEE
15 years 11 months ago
2001
IEEE
88
Voted
3DIC
2009
IEEE
15 years 9 months ago
2009
IEEE
139
click to vote
NANONET
2009
Springer
15 years 9 months ago
2009
Springer
A new approach for inserting repeaters in 3-D interconnects is proposed. The allocation of repeaters along an interplane interconnect is iteratively determined. The proposed approa...