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VLSID
2005
IEEE
153views VLSI» more  VLSID 2005»
14 years 10 months ago
Electromigration-Aware Physical Design of Integrated Circuits
The electromigration effect within current-density-stressed signal and power lines is an ubiquitous and increasingly important reliability and design problem in sub-micron IC desi...
Göran Jerke, Jens Lienig
3DIC
2009
IEEE
138views Hardware» more  3DIC 2009»
14 years 4 months ago
Wafer-scale 3D integration of InGaAs image sensors with Si readout circuits
Chang-Lee Chen, D.-R. Yost, Jeffrey M. Knecht, Dav...
NANONET
2009
Springer
200views Chemistry» more  NANONET 2009»
14 years 4 months ago
Repeater Insertion for Two-Terminal Nets in Three-Dimensional Integrated Circuits
A new approach for inserting repeaters in 3-D interconnects is proposed. The allocation of repeaters along an interplane interconnect is iteratively determined. The proposed approa...
Hu Xu, Vasilis F. Pavlidis, Giovanni De Micheli