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DAC
1999
ACM
14 years 20 days ago
Interconnect Analysis: From 3-D Structures to Circuit Models
In this survey paper we describethe combination of: discretized integral formulations, sparsication techniques, and krylov-subspace based model-order reduction that has led to rob...
Mattan Kamon, Nuno Alexandre Marques, Yehia Massou...
ISCAS
2007
IEEE
179views Hardware» more  ISCAS 2007»
14 years 2 months ago
Analysis for Signal and Power Integrity Using the Multilayered Finite Difference Method
— We present a method for fast analysis of signal and power integrity based on a recently developed multilayered finite difference method (M-FDM). In order to accurately model m...
Ege Engin, Krishna Bharath, Madhavan Swaminathan
CASES
2010
ACM
13 years 5 months ago
Hardware trust implications of 3-D integration
3-D circuit-level integration is a chip fabrication technique in which two or more dies are stacked and combined into a single circuit through the use of vertical electroconductiv...
Ted Huffmire, Timothy E. Levin, Michael Bilzor, Cy...
DAC
2004
ACM
14 years 9 months ago
Design automation for mask programmable fabrics
Programmable circuit design has played an important role in improving design productivity over the last few decades. By imposing structure on the design, efficient automation of s...
Narendra V. Shenoy, Jamil Kawa, Raul Camposano
AIA
2007
13 years 9 months ago
Minimizing leakage: What if every gate could have its individual threshold voltage?
Designers aim at fast but low-power consuming integrated circuits. Since high processing speed always comes with high energy demands, the literature provides several ways to reduc...
Ralf Salomon, Frank Sill, Dirk Timmermann