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ICCAD
2000
IEEE
171views Hardware» more  ICCAD 2000»
14 years 27 days ago
A Parametric Test Method for Analog Components in Integrated Mixed-Signal Circuits
In this paper, we present a novel approach to use test stimuli generated by digital components of a mixed-signal circuit for testing its analog components. A wavelet transform is ...
Michael Pronath, Volker Gloeckel, Helmut E. Graeb
ICCD
2007
IEEE
161views Hardware» more  ICCD 2007»
14 years 5 months ago
Scan chain design for three-dimensional integrated circuits (3D ICs)
Scan chains are widely used to improve the testability of IC designs. In traditional 2D IC designs, various design techniques on the construction of scan chains have been proposed...
Xiaoxia Wu, Paul Falkenstern, Yuan Xie
DAC
2006
ACM
14 years 9 months ago
Exploring compromises among timing, power and temperature in three-dimensional integrated circuits
Three-dimensional integrated circuits (3DICs) have the potential to reduce interconnect lengths and improve digital system performance. However, heat removal is more difficult in ...
Hao Hua, Christopher Mineo, Kory Schoenfliess, Amb...
ICCAD
2008
IEEE
246views Hardware» more  ICCAD 2008»
14 years 5 months ago
Integrated circuit design with NEM relays
—To overcome the energy-efficiency limitations imposed by finite sub-threshold slope in CMOS transistors, this paper explores the design of integrated circuits based on nanoelect...
Fred Chen, Hei Kam, Dejan Markovic, Tsu-Jae King L...
ICCAD
2006
IEEE
155views Hardware» more  ICCAD 2006»
14 years 5 months ago
Adaptive multi-domain thermal modeling and analysis for integrated circuit synthesis and design
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
Yonghong Yang, Changyun Zhu, Zhenyu (Peter) Gu, Li...