90 search results - page 5 / 18 » Design Methodology for Analog High Frequency ICs |
ASPDAC
2006
ACM
14 years 1 months ago
2006
ACM
This paper advances a new methodology based on signal-path information to resolve the problem of device-level placement for analog layout. This methodology is mainly based on three...
DATE
2006
IEEE
14 years 1 months ago
2006
IEEE
The existence of non-uniform thermal gradients on the substrate in high performance IC’s can significantly impact the performance of global on-chip interconnects. This issue is...
ICCAD
2009
IEEE
13 years 5 months ago
2009
IEEE
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
GECCO
2004
Springer
14 years 23 days ago
2004
Springer
This article summarizes two experiments utilizing building blocks to find analog electronic circuits on a CMOS Field Programmable Transistor Array (FPTA). The FPTA features 256 pr...
DAC
2004
ACM
14 years 8 months ago
2004
ACM
Resolution enhancement techniques (RET) such as optical proximity correction (OPC) and phase-shift mask (PSM) technology are deployed in modern processes to increase the fidelity ...