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» High-precision interconnect analysis
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SLIP
2006
ACM
14 years 1 months ago
Generation of design guarantees for interconnect matching
Manufacturable design requires matching of interconnects which have equal nominal dimensions. New design rules are projected to bring guarantee rules for interconnect matching. In...
Andrew B. Kahng, Rasit Onur Topaloglu
VLSID
2002
IEEE
109views VLSI» more  VLSID 2002»
14 years 7 months ago
Probabilistic Analysis of Rectilinear Steiner Trees
Steiner tree is a fundamental problem in the automatic interconnect optimization for VLSI design. We present a probabilistic analysis method for constructing rectilinear Steiner t...
Chunhong Chen
ICCAD
2006
IEEE
137views Hardware» more  ICCAD 2006»
14 years 4 months ago
Yield prediction for 3D capacitive interconnections
Capacitive interconnections are very promising structures for high-speed and low-power signaling in 3D packages. Since the performance of AC links, in terms of Band-Width and Bit-...
Alberto Fazzi, L. Magagni, Mario de Dominicis, Pao...
GLVLSI
2010
IEEE
161views VLSI» more  GLVLSI 2010»
13 years 11 months ago
Electromagnetic interaction of on-chip antennas and CMOS metal layers for wireless IC interconnects
The electromagnetic interaction of on-chip antennas and metal interconnects modeled in a 250 nm complementary metal-oxide semiconductor (CMOS) technology is investigated. A finite...
Ankit More, Baris Taskin
DAC
1998
ACM
14 years 8 months ago
A Mixed Nodal-Mesh Formulation for Efficient Extraction and Passive Reduced-Order Modeling of 3D Interconnects
As VLSI circuit speeds have increased, reliable chip and system design can no longer be performed without accurate threedimensional interconnect models. In this paper, we describe...
Nuno Alexandre Marques, Mattan Kamon, Jacob White,...