12 search results - page 2 / 3 » Microarchitecture level power and thermal simulation conside... |
ISQED
2006
IEEE
14 years 28 days ago
2006
IEEE
The increase in packing density has led to a higher power density in the chip which in turn has led to an increase in temperature on the chip. Temperature affects reliability, per...
ISCA
2003
IEEE
14 years 6 days ago
2003
IEEE
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
ASPLOS
2010
ACM
14 years 1 months ago
2010
ACM
Temperature is a dominant factor in the performance, reliability, and leakage power consumption of modern processors. As a result, increasing numbers of researchers evaluate therm...
GLVLSI
2010
IEEE
14 years 22 hour ago
2010
IEEE
Next generation industrial embedded platforms require the development of complex power and thermal management solutions. Indeed, an increasingly fine and intrusive thermal contro...
TVLSI
2010
13 years 1 months ago
2010
Abstract-- The operational characteristics of integrated circuits based on nanoscale semiconductor technology are expected to be increasingly affected by variations in the manufact...