This paper presents a new method for designing test wrappers for embedded cores with multiple clock domains. By exploiting the use of multiple shift frequencies, the proposed meth...
The gain-based technology mapping paradigm has been successfully employed for finding minimum delay and minimum area mappings. However, existing gain-based technology mappers fail...
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
Due to shrinking technology, increasing functional frequency and density, and reduced noise margins with supply voltage scaling, the sensitivity of designs to supply voltage noise...
For CMOS technologies below 65nm, gate oxide direct tunneling current is a major component of the total power dissipation. This paper presents a simulated annealing based algorith...
Saraju P. Mohanty, Ramakrishna Velagapudi, Elias K...