10 search results - page 2 / 2 » Placement of 3D ICs with Thermal and Interlayer Via Consider... |
ASPDAC
2007
ACM
13 years 11 months ago
2007
ACM
- 3D IC technologies can help to improve circuit performance and lower power consumption by reducing wirelength. Also, 3D IC technology can be used to realize heterogeneous system-...
DAC
2011
ACM
12 years 7 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
NANONET
2009
Springer
14 years 5 days ago
2009
Springer
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
ASPDAC
2005
ACM
14 years 1 months ago
2005
ACM
— The recent popularity of 3D IC technology stems from its enhanced performance capabilities and reduced wirelength. However, wire congestion and thermal issues are exacerbated d...
ICCAD
2007
IEEE
14 years 4 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...