Abstract—This work proposes reliability aware through silicon via (TSV) planning for the 3D stacked silicon integrated circuits (ICs). The 3D power distribution network is modele...
Amirali Shayan Arani, Xiang Hu, He Peng, Chung-Kua...
Semiconductor manufacturing process scaling increases leakage and transistor variations, both of which are problematic for static random access memory (SRAM). Since SRAM is a criti...
Sayeed A. Badrudduza, Ziyan Wang, Giby Samson, Law...
Graphene nanoribbon tunneling FETs (GNR TFETs) are promising devices for post-CMOS low-power applications because of the low subthreshold swing, high Ion/Ioff, and potential for l...
In this paper, a method for nominal design of analog integrated circuits is presented that includes process variations and operating ranges by worst-case parameter sets. These set...
Robert Schwencker, Frank Schenkel, Michael Pronath...
Graphene nanoribbon FETs (GNRFETs) are promising devices for beyond-CMOS nanoelectronics because of their excellent carrier transport properties and potential for large scale proc...
Mihir R. Choudhury, Youngki Yoon, Jing Guo, Kartik...