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» Reducing bus delay in submicron technology using coding
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GLVLSI
2006
IEEE
165views VLSI» more  GLVLSI 2006»
14 years 1 months ago
Block alignment in 3D floorplan using layered TCG
In modern IC design, the number of long on-chip wires has been growing rapidly because of the increasing circuit complexity. Interconnect delay has dominated over gate delay as te...
Jill H. Y. Law, Evangeline F. Y. Young, Royce L. S...
CODES
2004
IEEE
13 years 11 months ago
Power analysis of system-level on-chip communication architectures
For complex System-on-chips (SoCs) fabricated in nanometer technologies, the system-level on-chip communication architecture is emerging as a significant source of power consumpti...
Kanishka Lahiri, Anand Raghunathan
IOLTS
2006
IEEE
103views Hardware» more  IOLTS 2006»
14 years 1 months ago
Designing Robust Checkers in the Presence of Massive Timing Errors
So far, performance and reliability of circuits have been determined by worst-case characterization of silicon and environmental noise. As new deep sub-micron technologies exacerb...
Frederic Worm, Patrick Thiran, Paolo Ienne
DATE
2010
IEEE
162views Hardware» more  DATE 2010»
14 years 15 days ago
Error resilience of intra-die and inter-die communication with 3D spidergon STNoC
: Scaling down in very deep submicron (VDSM) technologies increases the delay, power consumption of on-chip interconnects, while the reliability and yield decrease. In high perform...
Vladimir Pasca, Lorena Anghel, Claudia Rusu, Ricca...
TC
2008
13 years 7 months ago
Adaptive Channel Buffers in On-Chip Interconnection Networks - A Power and Performance Analysis
On-chip interconnection networks (OCINs) have emerged as a modular and scalable solution for wire delay constraints in deep submicron VLSI design. OCIN research has shown that the ...
Avinash Karanth Kodi, Ashwini Sarathy, Ahmed Louri