A fundamental difference between ASICs and FPGAs is that wires in ASICs are designed such that it matches the requirements of a particular design. Wire parameters such as: length...
Abstract—On-chip interconnection network is a crucial design component in high-performance System-on-Chips (SoCs). Many of previous works have focused on the automation of its to...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Network-on-Chip (NoC) architectures have been adopted by a growing number of multi-core designs as a flexible and scalable solution to the increasing wire delay constraints in the...
Avinash Karanth Kodi, Ashwini Sarathy, Ahmed Louri