23 search results - page 1 / 5 » Reliability challenges for 45nm and beyond |
DAC
2006
ACM
14 years 11 months ago
2006
ACM
ICCAD
2006
IEEE
14 years 7 months ago
2006
IEEE
With semiconductor industry's aggressive march towards 45nm
ASPLOS
2010
ACM
14 years 5 months ago
2010
ACM
DRAM is facing severe scalability challenges in sub-45nm technology nodes due to precise charge placement and sensing hurdles in deep-submicron geometries. Resistive memories, suc...
MICRO
2009
IEEE
14 years 5 months ago
2009
IEEE
Aggressive technology scaling to 45nm and below introduces serious reliability challenges to the design of microprocessors. Large SRAM structures used for caches are particularly ...
DAC
2010
ACM
14 years 2 months ago
2010
ACM
As device size shrinks to the nanometer range, FPGAs are increasingly prone to manufacturing defects. We anticipate that the ability to tolerate multiple defects will be very impo...