Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...
Pingqiang Zhou, Yuchun Ma, Zhuoyuan Li, Robert P. ...
In this paper a layout-aware RF synthesis methodology is presented. The methodology combines the power of a differential evolution algorithm with cost function response modeling a...
Peter J. Vancorenland, Geert Van der Plas, Michiel...
Manufacturing process variability impacts the performance of synchronous logic circuits by means of its effect on both clock network and functional block delays. Typically, varia...