282 search results - page 54 / 57 » Reliability- and process-variation aware design of integrate... |
ISPD
2006
ACM
14 years 1 months ago
2006
ACM
Physical Design of modern systems on chip is extremely challenging. Such digital integrated circuits often contain tens of millions of logic gates, intellectual property blocks, e...
DATE
2010
IEEE
14 years 25 days ago
2010
IEEE
—Temperature has a strong influence on integrated circuit (IC) performance, power consumption, and reliability. However, accurate thermal analysis can impose high computation co...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures. To improve via yield and reliability, redundant-via insertion is a highl...
ICCD
2006
IEEE
14 years 4 months ago
2006
IEEE
— As silicon CMOS devices are scaled down into the nanoscale regime, new challenges at both the device and system level are arising. While some of these challenges will be overco...
DAC
2005
ACM
14 years 8 months ago
2005
ACM
While performance specifications are verified before sign-off for a modern nanometer scale design, extensive application of optical proximity correction substantially alters the l...