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ISQED
2009
IEEE
94views Hardware» more  ISQED 2009»
14 years 2 months ago
Simultaneous buffer and interlayer via planning for 3D floorplanning
As technology advances, the interconnect delay among modules plays dominant role in chip performance. Buffer insertion, as a traditional approach to reduce wire delay in 2D ICs, i...
Xu He, Sheqin Dong, Yuchun Ma, Xianlong Hong
ISLPED
2007
ACM
138views Hardware» more  ISLPED 2007»
13 years 9 months ago
Power optimal MTCMOS repeater insertion for global buses
This paper addresses the problem of power-optimal repeater insertion for global buses in the presence of crosstalk noise. MTCMOS technique by inserting high-Vth sleep transistors ...
Hanif Fatemi, Behnam Amelifard, Massoud Pedram
DAC
1999
ACM
13 years 11 months ago
Stand-by Power Minimization Through Simultaneous Threshold Voltage Selection and Circuit Sizing
We present a new approach for estimation and optimization of the average stand-by power dissipation in large MOS digital circuits. To overcome the complexity of state dependence i...
Supamas Sirichotiyakul, Tim Edwards, Chanhee Oh, J...
ANCS
2007
ACM
13 years 11 months ago
Design of adaptive communication channel buffers for low-power area-efficient network-on-chip architecture
Network-on-Chip (NoC) architectures provide a scalable solution to the wire delay constraints in deep submicron VLSI designs. Recent research into the optimization of NoC architec...
Avinash Karanth Kodi, Ashwini Sarathy, Ahmed Louri
ISVLSI
2008
IEEE
142views VLSI» more  ISVLSI 2008»
14 years 1 months ago
A Fuzzy Approach for Variation Aware Buffer Insertion and Driver Sizing
In nanometer regime, the effects of process variations are dominating circuit performance, power and reliability of circuits. Hence, it is important to properly manage variation e...
Venkataraman Mahalingam, Nagarajan Ranganathan