As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
The size and complexity of current custom VLSI have forced the use of high-level programming languages to describe hardware, and compiler and synthesis technology bstract designs ...
Darin Petkov, Randolph E. Harr, Saman P. Amarasing...
In this paper we propose a RObust Analog Design tool (ROAD) for post-tuning analog/RF circuits. Starting from an initial design derived from hand analysis or analog circuit synthe...
Xin Li, Padmini Gopalakrishnan, Yang Xu, Lawrence ...
† This paper describes a novel methodology to automate the design of the interconnect distribution for multistage clock circuits. We introduce two key ideas. First, a hierarchica...
—The application and research area of Multimedia Content Analysis (MMCA) considers all aspects of the automated extraction of new knowledge from large multimedia data streams and...
R. Yang, Robert D. van der Mei, D. Roubos, Frank J...