Power delivery is a growing reliability concern in microprocessors as the industry moves toward feature-rich, powerhungrier designs. To battle the ever-aggravating power consumpti...
Fayez Mohamood, Michael B. Healy, Sung Kyu Lim, Hs...
Switching activity-generated power-supply grid-noise presents a major obstacle to the reduction of supply voltage in future generation semiconductor technologies. A popular techniq...
Abstract—Today’s wirelessly networked embedded systems underlie a vast array of electronic devices, performing computation, communication, and input/output. A major design goal...
Modern CMOS manufacturing processes have significant variability, which necessitates guard banding to achieve reasonable yield. It is our thesis that variability should be addres...
Exponentially rising cooling/packaging costs due to high power density call for architectural and software-level thermal management. Dynamic thermal management (DTM) techniques co...