DAC
2012
ACM
12 years 2 months ago
2012
ACM
Caches play an important role in embedded systems by bridging the performance gap between high speed processors and slow memory. At the same time, caches introduce imprecision in ...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
Large-scale process variations can significantly limit the practical utility of microelectro-mechanical systems (MEMS) for RF (radio frequency) applications. In this paper we desc...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
Many state-of-the-art approaches on fault-tolerant system design make the simplifying assumption that all faults are detected within a certain time interval. However, based on a d...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
In this paper, we present a case study of our chip prototype of a 16-node 4x4 mesh NoC fabricated in 45nm SOI CMOS that aims to simultaneously optimize energy-latency-throughput f...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
Due to the large geometry of through-silicon-vias (TSVs) and their connections to the power grid, significant current crowding can occur in 3D ICs. Prior works model TSVs and pow...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
Powering down SDRAMs at run-time reduces memory energy consumption significantly, but often at the cost of performance. If employed speculatively with real-time memory controller...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
Addressing the challenges of extreme scale computing requires holistic design of new programming models and systems that support those models. This paper discusses the Angstrom pr...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
In this work we address the problem of managing interconnect timing in high-level synthesis by generating a layoutfriendly microarchitecture. A metric called spreading score is pr...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
Unknown values (Xs) may exist in a design due to uninitialized registers or blocks that are powered down. Due to X-pessimism in gate-level logic simulation, such Xs cannot be hand...
DAC
2012
ACM
12 years 2 months ago
2012
ACM
In this paper, we propose two methods used in 3D IC placement that effectively exploit the die-to-die thermal coupling in the stack. First, TSVs are spread on each die to reduce t...