DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
—The complexity of the test infrastructure and test strategies in systems-on-chip approaches the complexity of the functional design space. This paper presents test design space ...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
A new approach in hierarchical optimisation is presented which is capable of optimising both the performance and yield of an analogue design. Performance and yield trade offs are ...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
— Lithographic variability and its impact on printability is a major concern in today’s semiconductor manufacturing process. To address sub-wavelength printability, a number of...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
This contribution shows and discusses the requirements and constraints that an industrial engineering process defines for the integration of hardware IP into the system developmen...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
Abstract-Multi-detect (N-detect) testing suffers from the drawback that its test length grows linearly with N. We present a new method to generate compact test sets that provide hi...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
Abstract—Building highly optimized embedded systems demands hardware/software (HW/SW) co-design. A key challenge in co-design is the design of HW/SW interfaces, which is often a ...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
Abstract—In this paper a programmable Forward Error Correction (FEC) IP for a DVB-S2 receiver is presented. It is composed of a Low-Density Parity Check (LDPC), a Bose-ChaudhuriH...
DATE
2009
IEEE
14 years 3 months ago
2009
IEEE
— Heat removal and power delivery are two major reliability concerns in the 3D stacked IC technology. Liquid cooling based on micro-fluidic channels is proposed as a viable solu...