MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
Although silicon optical technology is still in its formative stages, and the more near-term application is chip-to-chip communication, rapid advances have been made in the develo...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
Designing and optimizing high performance microprocessors is an increasingly difficult task due to the size and complexity of the processor design space, high cost of detailed si...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
We present Adaptive Stream Detection, a simple technique for modulating the aggressiveness of a stream prefetcher to match a workload’s observed spatial locality. We use this co...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
With the trend towards increasing number of processor cores in future chip architectures, scalable directory-based protocols for maintaining cache coherence will be needed. Howeve...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
This paper presents and studies a distributed L2 cache management approach through OS-level page allocation for future many-core processors. L2 cache management is a crucial multi...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
Instruction aggregation—the grouping of multiple operations into a single processing unit—is a technique that has recently been used to amplify the bandwidth and capacity of c...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
The large working sets of commercial and scientific workloads stress the L2 caches of Chip Multiprocessors (CMPs). Some CMPs use a shared L2 cache to maximize the on-chip cache c...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
We introduce virtually-pipelined memory, an architectural technique that efficiently supports high-bandwidth, uniform latency memory accesses, and high-confidence throughput eve...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ISQED
2006
IEEE
14 years 3 months ago
2006
IEEE
The continuing VLSI technology scaling leads to increasingly significant power supply fluctuations, which need to be modeled accurately in circuit design and verification. Meanwhi...