— Since re-designing and re-optimizing existing logic, memory, and IP blocks in a 3D fashion significantly increases design cost, nearterm three-dimensional integrated circuit (...
But it ain’t about how hard you hit... it’s about how hard you can get hit, and keep moving forward. It’s how much you can take, and keep moving forward. That’s how winning...
In this paper, we propose a new technique, referred to as virtual probe (VP), to efficiently measure, characterize and monitor both inter-die and spatially-correlated intra-die va...
Thermal management is critical for integrated circuit (IC) design. With each new IC technology generation, feature sizes decrease, while operating speeds and package densities incr...
Philip Y. Paik, Vamsee K. Pamula, Krishnendu Chakr...
In hardware design, it is necessary to simulate the anticipated behavior of the integrated circuit before it is actually cast in silicon. As simulation procedures are long due to ...
- The need for faster circuits in smaller area with lower power dissipation has made it a common practice to use the domino CMOS in high performance integrated circuits. However th...
In this paper, we present a system synthesis algorithm, called MOCSYN, which partitions and schedules embedded system specifications to intellectual property cores in an integrate...
The integrated circuits design flow is rapidly moving towards higher description levels. However, test-related activities are lacking behind this trend, mainly since effective faul...
Because of the aggressive scaling of integrated circuits and the given limits of atomic scales, circuit designers have to become more and more aware of the arising reliability and...
High performance integrated circuits are now reaching the 100-plus watt regime, and power delivery and power grid signal integrity have become critical. Analyzing the performance ...
Haifeng Qian, Sani R. Nassif, Sachin S. Sapatnekar