FPT
2005
IEEE
14 years 6 months ago
2005
IEEE
Producing a functionally correct integrated circuit is becoming increasingly difficult. No matter how careful a designer is, there will always be integrated circuits that are fabr...
GLVLSI
2006
IEEE
14 years 6 months ago
2006
IEEE
3-dimensional integrated circuit (3D IC) technology places circuit blocks in the vertical dimension in addition to the conventional horizontal plane. Compared to conventional plan...
CIMCA
2006
IEEE
14 years 6 months ago
2006
IEEE
This paper describes an innovative work for nanorobot design and manufacturing, using a computer simulation and system on chip prototyping approach. The use of CMOS as integrated ...
SLIP
2009
ACM
14 years 7 months ago
2009
ACM
New technologies such as 3D integration are becoming a new force that is keeping Moore’s law in effect in today’s nano era. By adding a third dimension in current 2D circuits...
SLIP
2009
ACM
14 years 7 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
ASPDAC
2009
ACM
14 years 7 months ago
2009
ACM
— The enhanced packing densities facilitated by 3D integrated circuit technology also has an unwanted side-effect, in the form of increasing the amount of current per unit footpr...
ICCAD
2006
IEEE
14 years 9 months ago
2006
IEEE
The use of CMOS nanometer technologies at 65 nm and below will pose serious challenges on the design of mixed-signal integrated systems in the very near future. Rising design comp...
DAC
2002
ACM
15 years 1 months ago
2002
ACM
In this paper, a new type of Petri net called Hierarchical Colored Hardware Petri net, to model real-delay switching activity for power estimation is proposed. The logic circuit i...
DAC
2007
ACM
15 years 1 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...