Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Integrating a large number of on-chip voltage regulators holds the promise of solving many power delivery challenges through strong local load regulation and facilitates systemlev...
High performance integrated circuits are now reaching the 100-plus watt regime, and power delivery and power grid signal integrity have become critical. Analyzing the performance ...
Haifeng Qian, Sani R. Nassif, Sachin S. Sapatnekar
Power delivery is a growing reliability concern in microprocessors as the industry moves toward feature-rich, powerhungrier designs. To battle the ever-aggravating power consumpti...
Fayez Mohamood, Michael B. Healy, Sung Kyu Lim, Hs...
The increasing power dissipation of current processors and processor cores constrains design options, increases packaging and cooling costs, increases power delivery costs, and de...
Vasileios Kontorinis, Amirali Shayan, Dean M. Tull...
Data center power infrastructure incurs massive capital costs, which typically exceed energy costs over the life of the facility. To squeeze maximum value from the infrastructure,...
Steven Pelley, David Meisner, Pooya Zandevakili, T...