We have developed a new 3-dimensional stacking technology using wafer-to-wafer stacked method and evaluated the connectivity between TSV and micro-bump. The prototype 3-layer stac...
— We discuss the design of CMOS MEMS in a 3D SOI-CMOS technology. We present layout architectures, preliminary mechanics modeling using finite element analysis and release proce...
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
Xiuyi Zhou, Jun Yang 0002, Yi Xu, Youtao Zhang, Ji...
A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, high-speed interface to increase the device density and ...
Xiuyi Zhou, Yi Xu, Yu Du, Youtao Zhang, Jun Yang 0...