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» Buffer Insertion for Noise and Delay Optimization
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ISQED
2009
IEEE
94views Hardware» more  ISQED 2009»
14 years 3 months ago
Simultaneous buffer and interlayer via planning for 3D floorplanning
As technology advances, the interconnect delay among modules plays dominant role in chip performance. Buffer insertion, as a traditional approach to reduce wire delay in 2D ICs, i...
Xu He, Sheqin Dong, Yuchun Ma, Xianlong Hong
GLVLSI
2009
IEEE
155views VLSI» more  GLVLSI 2009»
14 years 3 months ago
Buffer design and optimization for lut-based structured ASIC design styles
The interconnection delay of pre-fabricated design style dominates circuit delay due to the heavily downstream capacitance. Buffer insertion is a widely used technique to split o...
Po-Yang Hsu, Shu-Ting Lee, Fu-Wei Chen, Yi-Yu Liu
ISQED
2002
IEEE
126views Hardware» more  ISQED 2002»
14 years 1 months ago
Formulae for Performance Optimization and Their Applications to Interconnect-Driven Floorplanning
As the process technology advances into the deep submicron era, interconnect plays a dominant role in determining circuit performance. Buffer insertion/sizing and wire sizing are ...
Nicholas Chia-Yuan Chang, Yao-Wen Chang, Iris Hui-...
ICCAD
2001
IEEE
152views Hardware» more  ICCAD 2001»
14 years 5 months ago
Hybrid Structured Clock Network Construction
This paper hierarchically constructs a hybrid mesh/tree clock network structure consisting of overlying zero-skew clock meshes, with underlying zero-skew clock trees originating f...
Haihua Su, Sachin S. Sapatnekar
DAC
2011
ACM
12 years 8 months ago
Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC
This paper studies TSV-to-TSV coupling in 3D ICs. A full-chip SI analysis flow is proposed based on the proposed coupling model. Analysis results show that TSVs cause significan...
Chang Liu, Taigon Song, Jonghyun Cho, Joohee Kim, ...