3D integration is an emergent technology that has the potential to greatly increase device density while simultaneously providing faster on-chip communication. 3D fabrication invo...
Aggressive technology scaling over the years has helped improve processor performance but has caused a reduction in processor reliability. Shrinking transistor sizes and lower sup...
3D integration technology greatly increases transistor density while providing faster on-chip communication. 3D implementations of processors can simultaneously provide both laten...
The current methodology used in mass-market processor design is to create a single base microarchitecture (e.g., Intel's "Core"or AMD's"K8") that is ...
Process variations in integrated circuits have significant impact on their performance, leakage and stability. This is particularly evident in large, regular and dense structures...