We present and evaluate a novel switching mechanism called layered switching. Conceptually, the layered switching implements wormhole on top of virtual cut-through switching. To s...
We propose a framework that allows dual-layer cooperative error control in a nanoscale network-on-chip (NoC), to simultaneously improve reliability, performance and energy efficie...
We propose a packet switched platform for single chip systems which scales well to an arbitrary number of processor like resources. The platform, which we call Network-on-Chip (NO...
Shashi Kumar, Axel Jantsch, Mikael Millberg, Johnn...
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
Igor Loi, Subhasish Mitra, Thomas H. Lee, Shinobu ...
—The physical performance of a 3-Dimensional Network-on-Chip (NoC) mesh architecture employing Through Silicon Vias (TSV) for vertical connectivity is investigated with a cycle-a...
Matt Grange, Awet Yemane Weldezion, Dinesh Pamunuw...