66 search results - page 11 / 14 » Optimization of critical paths in circuits with level-sensit... |
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Abstract— Design variability due to within-die and die-todie process variations has the potential to significantly reduce the maximum operating frequency and the effective yield...
ICCAD
2004
IEEE
14 years 4 months ago
2004
IEEE
— In deep sub-micron technologies, process variations can cause significant path delay and clock skew uncertainties thereby lead to timing failure and yield loss. In this paper,...
ASPDAC
2004
ACM
14 years 1 months ago
2004
ACM
— The problem of minimizing dynamic power consumption by scaling down the supply voltage of computational elements off critical paths is widely addressed in the literature for th...
ICCTA
2007
IEEE
13 years 11 months ago
2007
IEEE
In this paper, we propose a placement method for islandstyle FPGAs, based on fast yet very good initial placement followed by refinement using ultra-low temperature Simulated Anne...
DAC
2010
ACM
13 years 11 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...