In this paper, we present the rst chip-level electrothermal simulator, iCET. For a given chip layout, packaging material, user-specied input signal patterns, and thermal boundar...
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
Power optimization is of growing importance for FPGAs in nanometer technologies. Considering dual-Vdd technique, we show that configurable power supply is required to obtain a sat...
With increasing aggregate off-chip bandwidths exceeding terabits/second (Tb/s), the power dissipation is a serious design consideration. Additionally, design of I/O links is const...
Hamid Hatamkhani, Frank Lambrecht, Vladimir Stojan...
Chips manufactured in 90 nm technology have shown large parametric variations, and a worsening trend is predicted. These parametric variations make circuit optimization difficult ...
Jinjun Xiong, Vladimir Zolotov, Natesan Venkateswa...