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DAC
1996
ACM
15 years 10 months ago
iCET: A Complete Chip-Level Thermal Reliability Diagnosis Tool for CMOS VLSI Chips
In this paper, we present the rst chip-level electrothermal simulator, iCET. For a given chip layout, packaging material, user-speci ed input signal patterns, and thermal boundar...
Yi-Kan Cheng, Chin-Chi Teng, Abhijit Dharchoudhury...
DAC
2011
ACM
14 years 5 months ago
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
In this work, we propose an efficient and accurate full-chip thermomechanical stress and reliability analysis tool and design optimization methodology to alleviate mechanical rel...
Moongon Jung, Joydeep Mitra, David Z. Pan, Sung Ky...
DAC
2004
ACM
16 years 6 months ago
FPGA power reduction using configurable dual-Vdd
Power optimization is of growing importance for FPGAs in nanometer technologies. Considering dual-Vdd technique, we show that configurable power supply is required to obtain a sat...
Fei Li, Yan Lin, Lei He
DAC
2006
ACM
16 years 6 months ago
Power-centric design of high-speed I/Os
With increasing aggregate off-chip bandwidths exceeding terabits/second (Tb/s), the power dissipation is a serious design consideration. Additionally, design of I/O links is const...
Hamid Hatamkhani, Frank Lambrecht, Vladimir Stojan...
DAC
2006
ACM
16 years 6 months ago
Criticality computation in parameterized statistical timing
Chips manufactured in 90 nm technology have shown large parametric variations, and a worsening trend is predicted. These parametric variations make circuit optimization difficult ...
Jinjun Xiong, Vladimir Zolotov, Natesan Venkateswa...