ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
In this paper, we present an efficient method to solve the obstacle-avoiding rectilinear Steiner minimum tree (OARSMT) problem optimally. Our work is a major improvement over the w...
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
Through-silicon via (TSV) fabrication causes tensile stress around TSVs which results in significant carrier mobility variation in the devices in their neighborhood. Keep-out zone ...
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
1In this paper, we will present an effective layout method for analog circuits. We consider symmetry constraint, common centroid constraint, device merging and device clustering du...
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
Elastic systems, either synchronous or asynchronous, can be optimized for the average-case performance when they have units with early evaluation or variable latency. The performan...
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
With aggressive technology scaling, integrated circuits suffer from everincreasing wearout effects and their lifetime reliability has become a serious concern for the industry. Fo...
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
Abstract--We present a methodology for implementing digital signal processing (DSP) operations such as filtering with biomolecular reactions. From a DSP specification, we demonstra...
ICCAD
2010
IEEE
13 years 9 months ago
2010
IEEE
In 3D integrated circuits through silicon vias (TSVs) are used to connect different dies stacked on top of each other. These TSV occupy silicon area and have significantly larger a...