3DIC
2009
IEEE
14 years 8 months ago
2009
IEEE
—A high-sensitivity capacitive-coupling interface is presented for wireless wafer testing systems. The transmitter is a buffer that drives the transmitter pad, and the receiver c...
3DIC
2009
IEEE
14 years 8 months ago
2009
IEEE
Abstract—Modeling parasitic parameters of Through-SiliconVia (TSV) structures is essential in exploring electrical characteristics such as delay and signal integrity (SI) of circ...
3DIC
2009
IEEE
14 years 8 months ago
2009
IEEE
3DIC
2009
IEEE
14 years 8 months ago
2009
IEEE
The first memristor, originally theorized by Dr. Leon Chua in 1971, was identified by a team at HP Labs in 2008. This new fundamental circuit element is unique in that its resis...
3DIC
2009
IEEE
14 years 8 months ago
2009
IEEE
- This paper describes a new architectural paradigm for fully connected, single-hop system level interconnection networks. The architecture is scalable enough to meet the needs of ...
3DIC
2009
IEEE
14 years 8 months ago
2009
IEEE
—The physical performance of a 3-Dimensional Network-on-Chip (NoC) mesh architecture employing Through Silicon Vias (TSV) for vertical connectivity is investigated with a cycle-a...
FPGA
2010
ACM
14 years 8 months ago
2010
ACM
FPGA
2010
ACM
14 years 8 months ago
2010
ACM
FLOPS
2010
Springer
14 years 8 months ago
2010
Springer
FLOPS
2010
Springer
14 years 8 months ago
2010
Springer
Abstract. We present the meta-theory behind the code generation facilities of Isabelle/HOL. To bridge the gap between the source (higherorder logic with type classes) and the many ...