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ISQED
2003
IEEE
87views Hardware» more  ISQED 2003»
14 years 2 months ago
Coupled Simulation of Circuit and Piezoelectric Laminates
In this paper, an algorithm for the coupled simulation of circuit and piezoelectric laminate devices is presented. A finite element solver for piezoelectric laminates is included ...
Chenggang Xu, Terri S. Fiez, Kartikeya Mayaram
ISQED
2003
IEEE
104views Hardware» more  ISQED 2003»
14 years 2 months ago
On-Chip Interconnect Inductance - Friend or Foe (Invited)
Inductance associated with on-chip wires can no longer be ignored as chip operation frequencies increase into GHz regime. Because the magnetic field propagates a very long range, ...
S. Simon Wong, C. Patrick Yue, Richard Chang, So-Y...
ISQED
2003
IEEE
644views Hardware» more  ISQED 2003»
14 years 2 months ago
Procedural Analog Design (PAD) Tool
Danica Stefanovic, Maher Kayal, Marc Pastre, Vanco...
ISQED
2003
IEEE
85views Hardware» more  ISQED 2003»
14 years 2 months ago
PDL: A New Physical Synthesis Methodology
In this paper, we propose a new physical synthesis methodology, PDL, which relaxes the timing constraints to obtain best optimality in terms of layout quality and timing quality. ...
Toshiyuki Shibuya, Rajeev Murgai, Tadashi Konno, K...
ISQED
2003
IEEE
119views Hardware» more  ISQED 2003»
14 years 2 months ago
System and Framework for QA of Process Design Kits
In this paper, we evaluate the dependencies between tools, data and environment in process design kits, and present a framework for systematically analyzing the quality of the des...
M. C. Scott, M. O. Peralta, Jo Dale Carothers
ISQED
2003
IEEE
71views Hardware» more  ISQED 2003»
14 years 2 months ago
Revisiting the Noise Figure Design Metric for Digital Communication Receiver
Noise figure is a commonly used system parameter that quantifies the degradation in the signal-to-noise ratio (SNR) as the signal passes through a receiving system. Because of the...
Won Namgoong, Jongrit Lerdworatawee
ISQED
2003
IEEE
123views Hardware» more  ISQED 2003»
14 years 2 months ago
Advanced Module Packaging Method
An intermediate solution between conventional printed circuit board technology and wafer level packaging, WLP, is to fabricate interconnection circuits and flip chip assembly stru...
Peter C. Salmon
ISQED
2003
IEEE
121views Hardware» more  ISQED 2003»
14 years 2 months ago
Monolithic DC-DC Converter Analysis And Mosfet Gate Voltage Optimization
— The design of an efficient monolithic buck converter is presented in this paper. A low swing MOSFET gate drive technique is proposed that improves the efficiency characteristic...
Volkan Kursun, Siva Narendra, Vivek De, Eby G. Fri...
ISQED
2003
IEEE
127views Hardware» more  ISQED 2003»
14 years 2 months ago
Statistical Modeling for Circuit Simulation
Accurate statistical simulation and modeling are important for IC design. Different types of statistical simulation require different types of statistical models. In this paper a ...
Colin C. McAndrew
ISQED
2003
IEEE
104views Hardware» more  ISQED 2003»
14 years 2 months ago
A CAD-Oriented Modeling Approach of Frequency-Dependent Behavior of Substrate Noise Coupling for Mixed-Signal IC Design
A simple, efficient CAD-oriented equivalent circuit modeling approach of frequency-dependent behavior of substrate noise coupling is presented. It is shown that the substrate exhi...
Hai Lan, Zhiping Yu, Robert W. Dutton