ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
This paper presents an approach for analysis of system state differences observable through the scan chain for the debug of functional failures. A novel methodology for Latch Dive...
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
This work discusses the impact of power consumption on the test time of core-based systems, when an available on-chip network is reused as test access mechanism. A previously prop...
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
The interconnection network consumes the majority of die area in an FPGA. Presented is a scalable manufacturing test method for all SRAM-based FPGAs, able to detect multiple inter...
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
ct This paper describes a general technique to test external memory/caches and memory interconnects using on-chip logic. Such a test methodology is expected to significantly reduc...
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
Scan-based architectures, though widely used in modern designs, are expensive in power consumption. In this paper, we present a new technique that allows to design power-optimized...
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
Multiple-detect test sets have been shown to be effective in lowering defect level. Other researchers have noted that observing the effects of a defect can be controlled by sensit...
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
In a scan-based system with a large number of flip-flops, a major component of power is consumed during scanshift and clocking operation in test mode. In this paper, a novel scan-...
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
This paper presents the impact of multiple-detect test patterns on outgoing product quality. It introduces an ATPG tool that generates multiple-detect test patterns while maximizi...
ITC
2003
IEEE
14 years 2 months ago
2003
IEEE
An early-life reliability model is presented that allows wafer test information to be used to predict not only the total number of burn-in failures that occur for a given product,...