Most existing buffering algorithms neglect the impact of inductance on circuit performance, which causes large error in circuit analysis and optimization. Even for the approaches...
Abstract— Chip-package thermal analysis is necessary for the design and synthesis of reliable, high-performance, low-power, compact integrated circuits (ICs). Many methods of IC ...
—Decoupling capacitors (decaps) are a popular means for reducing power-supply noise in integrated circuits. Since the decaps are usually inserted in the whitespace of the device ...
The International Technology Roadmap for Semiconduc-tors (ITRS) seeks to stimulate invention and research lead-ing to one or more new nanoelectronics technologies that may extend ...
As CMOS technology scales into the nanometer regime, power dissipation and associated thermal concerns in high-performance ICs due to on-chip hot-spots and thermal gradients are b...
Leveraging conventional microsystems technology, MEMS has become the technology of choice for a wide range of applications including inertial sensors for automotive, games, and co...
Statistical static timing analysis (SSTA) has become a key method for analyzing the effect of process variation in aggressively scaled CMOS technologies. Much research has focused...
— Trajectory-based methods offer an attractive methodology for automated, on-demand generation of macromodels for custom circuits. These models are generated by sampling the stat...
The existing work on via-stapling in 3D integrated circuits optimizes power and thermal integrity separately and uses steadystate thermal analysis. This paper presents the first ...