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    MR
    2006
    73views Robotics» more  MR 2006»
    Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs
    13 years 8 months ago
    Reduced temperature dependence of hot carrier degradation in deuterated nMOSFETs
    Download  sc.el.utwente.nl
    Deuterated oxides exhibit prolonged hot carrier lifetimes at room temperature. We report evidence that this improved hot carrier hardness exists over the temperature range between...
    Cora Salm, André J. Hof, Fred G. Kuper, Jur...
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    MR
    2006
    75views Robotics» more  MR 2006»
    New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors
    13 years 8 months ago
    New experimental findings on hot-carrier-induced degradation in lateral DMOS transistors
    Download  sdtlab.incheon.ac.kr
    In Kyung Lee, Se Re Na Yun, Kyosun Kim, Chong-Gun ...
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    MR
    2006
    58views Robotics» more  MR 2006»
    Drop impact reliability testing for lead-free and lead-based soldered IC packages
    13 years 8 months ago
    Drop impact reliability testing for lead-free and lead-based soldered IC packages
    Download  www.utacgroup.com
    Board-level drop impact testing is a useful way to characterize the drop durability of the different soldered assemblies onto the printed circuit board (PCB). The characterization...
    Desmond Y. R. Chong, F. X. Che, John H. L. Pang, K...
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    MR
    2006
    73views Robotics» more  MR 2006»
    Reliability of large periphery GaN-on-Si HFETs
    13 years 8 months ago
    Reliability of large periphery GaN-on-Si HFETs
    Download  www.nitronex.com
    S. Singhal, T. Li, A. Chaudhari, A. W. Hanson, R. ...
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    MR
    2006
    92views Robotics» more  MR 2006»
    Failure mechanism of trench IGBT under short-circuit after turn-off
    13 years 8 months ago
    Failure mechanism of trench IGBT under short-circuit after turn-off
    Download  hal.archives-ouvertes.fr
    Power semiconductor devices under short-circuit are submitted to high current and high voltage simultaneously that induce high electrical and thermal stresses. Several types of ev...
    A. Benmansour, Stephane Azzopardi, J. C. Martin, E...
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    MR
    2006
    57views Robotics» more  MR 2006»
    Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
    13 years 8 months ago
    Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading
    Download  www3.ntu.edu.sg
    Interface reliability issue has become a major concern in developing flip chip assembly. The CTE mismatch between different material layers may induce severe interface delaminatio...
    Y. L. Zhang, D. X. Q. Shi, W. Zhou
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    MR
    2006
    80views Robotics» more  MR 2006»
    A 3D analysis technique for detecting trace metal contamination
    13 years 8 months ago
    A 3D analysis technique for detecting trace metal contamination
    Download  www-lsits.ist.osaka-u.ac.jp
    Yasunori Goto, Tomokatsu Higuchi
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    MR
    2006
    74views Robotics» more  MR 2006»
    Lock-in thermal IR imaging using a solid immersion lens
    13 years 8 months ago
    Lock-in thermal IR imaging using a solid immersion lens
    Download  www.mpi-halle.de
    A hemispherical silicon solid immersion lens (SIL) was used to improve the spatial resolution of front-side thermal IR imaging in lock-in mode. The bottom of the SIL was cone-shap...
    O. Breitenstein, F. Altmann, T. Riediger, D. Karg,...
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    MR
    2006
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    Thermal characterization and modeling of power hybrid converters for distributed power systems
    13 years 8 months ago
    Thermal characterization and modeling of power hybrid converters for distributed power systems
    Download  www2.unipr.it
    Paolo Cova, Nicola Delmonte, Roberto Menozzi
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    MR
    2006
    71views Robotics» more  MR 2006»
    High-temperature reliability of Flip Chip assemblies
    13 years 8 months ago
    High-temperature reliability of Flip Chip assemblies
    Download  www.cie-info.org.cn
    T. Braun, K.-F. Becker, M. Koch, V. Bader, Rolf As...
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