TCAD
2008
13 years 11 months ago
2008
Due to the increasing abstraction gap between the initial system model and a final implementation, the verification of the respective models against each other is a formidable task...
TCAD
2008
13 years 11 months ago
2008
As the technology node advances into the nanometer era, via-open defects are one of the dominant failures due to the copper cladding process. To improve via yield and reliability, ...
TCAD
2008
13 years 11 months ago
2008
Starting at the 65-nm node, stress engineering to improve the performance of transistors has been a major industry focus. An intrinsic stress source--shallow trench isolation (STI)...
TCAD
2008
13 years 11 months ago
2008
Abstract--The electrostatic discharge (ESD) problem has become a challenging reliability issue in nanometer-circuit design. High voltages that resulted from ESD might cause high cu...
TCAD
2008
13 years 11 months ago
2008
Abstract--A key design constraint of circuits used in handheld devices is the power consumption, mainly due to battery life limitations. Adaptive power management (APM) techniques ...
TCAD
2008
13 years 11 months ago
2008
Abstract--Advances in very large-scale integration technology make clock skew more susceptible to process variations. Notwithstanding efficient exact zero-skew algorithms, clock sk...
TCAD
2008
13 years 11 months ago
2008
We propose a methodology for the early estimation of communication implementation choices eftarting from an abstract transaction level system model (TLM). The reference version of ...
TCAD
2008
13 years 11 months ago
2008
Safety-critical feedback-control applications may suffer faults in the controlled plant as well as in the execution platform, i.e., the controller. Control theorists design the con...
TCAD
2008
13 years 11 months ago
2008
The verification of a system-on-chip is challenging due to its high level of integration. Multiple components in a system can behave concurrently and compete for resources. Hence, ...
TCAD
2008
13 years 11 months ago
2008
An efficient method based on a direct boundary element method is proposed for extracting frequency-dependent substrate coupling parameters. A frequency-independent real-valued line...