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» A VHDL-based bus model for multi-PCB system design
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DATE
2006
IEEE
147views Hardware» more  DATE 2006»
14 years 3 months ago
Quantitative analysis of transaction level models for the AMBA bus
The increasing complexity of embedded systems pushes system designers to higher levels of abstraction. Transaction Level Modeling (TLM) has been proposed to model ation in systems...
Gunar Schirner, Rainer Dömer
DAC
2006
ACM
14 years 10 months ago
GreenBus: a generic interconnect fabric for transaction level modelling
In this paper we present a generic interconnect fabric for transaction level modelling tackeling three major aspects. First, a review of the bus and IO structures that we have ana...
Wolfgang Klingauf, Robert Günzel, Oliver Brin...
DATE
2009
IEEE
126views Hardware» more  DATE 2009»
14 years 4 months ago
Fast and accurate protocol specific bus modeling using TLM 2.0
—The need to have Transaction Level models early in the design cycle is becoming more and more important to shorten the development times of complex Systems-on-Chip (SoC). These ...
H. W. M. van Moll, Henk Corporaal, Víctor R...
DATE
2003
IEEE
135views Hardware» more  DATE 2003»
14 years 2 months ago
Estimation of Bus Performance for a Tuplespace in an Embedded Architecture
This paper describes a design methodology for the estimation of bus performance of a tuplespace for factory automation. The need of a tuplespace is motivated by the characteristic...
Nicola Drago, Franco Fummi, Marco Monguzzi, Giovan...
DATE
2000
IEEE
88views Hardware» more  DATE 2000»
14 years 2 months ago
Techniques for Reducing Read Latency of Core Bus Wrappers
Today’s system-on-a-chip designs consist of many cores. To enable cores to be easily integrated into different systems, many propose creating cores with their internal logic sep...
Roman L. Lysecky, Frank Vahid, Tony Givargis