Variations in the semiconductor fabrication process results in variability in parameters between transistors on the same die, a problem exacerbated by lithographic scaling. The re...
The growing impact of within-die process variation has created the need for statistical timing analysis, where gate delays are modeled as random variables. Statistical timing anal...
Aseem Agarwal, David Blaauw, Vladimir Zolotov, Sar...
Shrinking devices to the nanoscale, increasing integration densities, and reducing of voltage levels down to the thermal limit, all conspire to produce faulty systems. Frequent oc...
Kundan Nepal, R. Iris Bahar, Joseph L. Mundy, Will...
With increasing IC process variation and increased operating speed, it is more likely that even subtle defects will lead to the malfunctioning of a circuit. Various fault models, ...
This paper presents a Path Swapping (PS) method which enables to enhance the security of Quasi Delay Insensitive Asynchronous Circuits against Power Analysis (PA) attack. This appr...