ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
Precise chip-level timing requires careful modeling of the interaction between logic drivers and interconnect. Existing static-timing analysis methodologies generate models for dr...
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
Double-Gate (DG) transistor has emerged as the most promising device for nano-scale circuit design. Independent control of front and back gate in DG devices can be effectively use...
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
This paper presents a novel compact passive modeling technique for high-performance RF passives and interconnects modeled as high-order RLCM circuits. The new method is based on a...
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
In this paper, design and measurement results of a test chip that intends to evaluate differences between layout techniques for rectangular unit-capacitor arrays are introduced. P...
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
The purpose of this work is to explore how device operation parameters such as switching speed and power dissipation scale with voltage and temperature. We simulated a CMOS ring o...
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
The purpose of the paper is to introduce a new failure rate-based methodology for reliability simulation of deep submicron CMOS integrated circuits. Firstly, two of the state-of-t...
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
As technology scales down, power supply noise is becoming a performance and reliability bottleneck in modern VLSI. We propose a power supply noise-aware design methodology for hig...
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
This paper proposes an efficient automation platform that provides fast and reliable path to analog circuit design for desired specifications. Circuit heuristics and hierarchy a...
ISQED
2005
IEEE
14 years 2 months ago
2005
IEEE
Multi-project wafer having several chips placed on the same reticle to lower mask cost is key to low-volume IC fabrication. In this paper1 , we proposed two MILP models for simult...