— As technology scales into the sub-90nm domain, manufacturing variations become an increasingly significant portion of circuit delay. As a result, delays must be modeled as sta...
Matthew R. Guthaus, Natesan Venkateswaran, Chandu ...
— Nanoscale technologies provide both challenges and opportunities. We show that the issues and potential solutions facing designers are technology independent and arise mainly f...
As technology scales, the shrinking wire width increases the interconnect resistivity, while the decreasing interconnect spacing significantly increases the coupling capacitance. ...
Maged Ghoneima, Yehea I. Ismail, Muhammad M. Khell...
We describe an interconnect scheme based on lossy transmission lines, compare this scheme with traditional bus based links, and present performance data. Unlike some other schemes...
— In this paper we propose an exact algorithm that maximizes the sharing of partial terms in Multiple Constant Multiplication (MCM) operations. We model this problem as a Boolean...
— The flip-chip package gives the highest chip density of any packaging method to support the pad-limited Application-Specific Integrated Circuit (ASIC) designs. In this paper,...
Abstract— A Kauffman network is an abstract model of gene regulatory networks. Each gene is represented by a vertex. An edge from one vertex to another implies that the former ge...
Abstract— Physics offers several active devices with nanometerscale footprint, which can be best used in combination with a CMOS subsystem. Such hybrid circuits offer the potenti...