Today’s low cost wireless phones have driven a need to be able to economically test high volumes of complex RF IC’s at a fraction of the cost of the IC. In June of 2001 the IB...
This summary of selected microelectromechanical systems (MEMS) processes guides the reader through a wide variety of fabrication techniques used to make micromechanical structures...
This paper describes the implementation of a test pattern language using STIL [1], the IEEE Standard Test Interface Language (1450-1999), in a next generation, open architecture A...
The custom testability strategy of the Alpha 21364, Hewlett-Packard’s most recent Alpha microprocessor, builds upon its Alpha 21264 embedded core. Several additional DFT feature...
Scott Erlanger, Dilip K. Bhavsar, Richard A. Davie...
The IEEE 1149.6 standard was approved in March of 2003. The standard extends the capability of the IEEE 1149.1 standard to include AC-coupled and/or differential nets. These nets ...
Bill Eklow, Carl Barnhart, Mike Ricchetti, Terry B...
Faster defect localization is achieved by combining IC simulations and internal measurements. Time resolved photon emission records photons emitted during commutations (current) r...
Romain Desplats, Felix Beaudoin, Philippe Perdu, N...
This paper presents an approach for analysis of system state differences observable through the scan chain for the debug of functional failures. A novel methodology for Latch Dive...
This work discusses the impact of power consumption on the test time of core-based systems, when an available on-chip network is reused as test access mechanism. A previously prop...